SemiNex laser devices consist of a single semiconductor laser chip fiber-coupled into 50um, 100um or 200um fiber yielding high optical powers in continuous wave operation. The lasers can be packaged in a hermetic module, which includes a thermal electric cooler and a thermistor. This package offers a modular laser unit that is robust and easy to integrate into laser systems. SemiNex also sells chips in uncooled packages or in chip-on-submount or bar-on-submount form to meet specific customer needs.
SemiNex can build laser chips and sub-assemblies to customer's specifications, which can define:
- Wavelength between 1330nm an 1610nm
- Aperture width
- Chip length
- Optical power
- Conversion efficiency
- Mounting & Packaging configuration
SemiNex can provide raw chips or bars or SemiNex can package and test the lasers in various standard mountings such as:
- C-mount
- Chip on Submount
- High Heat Load (in window or fiber-coupled)
